垂直电镀线两种夹具比较  

Comparison of two kinds of fixtures for vertical electroplating line

作　　者：李小王 马宝华 高平安 黄生荣 Li Xiaowang;Ma Baohua;Gao Pingan;Huang Shengrong

机构地区：[1]惠州中京电子科技有限公司

出　　处：《印制电路信息》2019年第7期28-31,共4页Printed Circuit Information

摘　　要：对于传统垂直电镀线而言,电镀夹具的好坏直接影响到镀铜效率以及电镀质量,尤其在图形电镀中,夹具导电性问题将会导致镀铜薄厚不均,造成蚀刻不净毛边过大。文章通过垂直线不同类型电镀夹具进行比较。As vertical plating line, the plating fixture directly affects the efficiency and quality of copper plating. Especially in the pattern plating, because the fixture conductive problems will lead to the uneven thickness of copper, the etching will have defect such as poor etching or spurs. In this paper, different types of plating fixtures for vertical plating line are compared.

关 键 词：夹具导电性 电镀均匀性 使用寿命 后期维护 

分 类 号：TN41[电子电信—微电子学与固体电子学]