两种无氰碱铜工艺与氰化镀铜的性能对比  

Comparison between two cyanide-free copper electroplating processes and cyanide copper electroplating

作　　者：徐金来 XU Jin-lai(Guangzhou Honway Tech. Corp., Guangzhou 510663, China)

机构地区：[1]广州鸿葳科技股份有限公司,广东广州510663

出　　处：《电镀与涂饰》2019年第13期653-657,共5页Electroplating & Finishing

摘　　要：从镀液配方和工艺条件,镀层结合力、孔隙率和微观形貌,以及分散能力、覆盖能力、沉积速率、阴极电流效率等方面比较了无氰光亮碱铜、氰化镀铜和一般无氰碱铜这3种钢铁表面预镀铜工艺的性能,总结了它们的优缺点。Three types of copper pre-electroplating processes i.e. bright cyanide-free alkaline copper electroplating, cyanide copper electroplating, and ordinary cyanide-free alkaline copper electroplating for steel substrates were compared with respect to the bath composition, process conditions, adhesion, porosity, micromorphology, throwing power, covering power, deposition rate, cathodic current efficiency, and etc. Their advantages and disadvantages were summarized.

关 键 词：无氰碱性镀铜 氰化镀铜 分散能力 结合力 沉积速率 电流效率 

分 类 号：TQ153.14[化学工程—电化学工业]