环氧树脂中温潜伏型固化剂研究进展  

Research progress of medium temperature latent curing agent for epoxy resin

作　　者：赵玉春 刘浩[1] 李智慧 刘文涛[1] 黄淼铭 何素芹[1,3] 朱诚身[1] ZHAO Yu-chun;LIU Hao;LI Zhi-hui;LIU Wen-tao;HUANG Miao-ming;HE Su-qin;ZHU Cheng-shen(Institute of Materials Science and Engineering, Zhengzhou University, Zhengzhou 450001,China;Sinopec Zhongyuan Oilfield Company Petroleum Engineering Technology Research Institute, Puyang 457000, China;Henan Key Laboratory of Advanced Nylon Materials and Application ^Zhengzhou University) , Zhengzhou 450001, China)

机构地区：[1]郑州大学材料科学与工程学院,河南郑州450001 [2]中石化中原油田分公司石油工程技术研究院,河南濮阳457000 [3]河南省先进尼龙材料及应用重点实验室(郑州大学),河南郑州450001

出　　处：《热固性树脂》2019年第4期66-70,共5页Thermosetting Resin

基　　金：国家科技重大专项子项目(2016ZX05017-003)

摘　　要：综述了双氰胺、咪唑、酸酐、微胶囊等几类中温潜伏型固化剂在环氧树脂体系中的应用和改性研究进展,并对该类固化体系未来的研究发展方向作出了展望。The application and modification progress of several kinds of medium temperature latent curing agents such as dicyandiamide,imidazole,acid anhydride and microcapsules in epoxy resin system were reviewed,and the future research directions of such curing systems were prospected.

关 键 词：环氧树脂 中温潜伏型固化剂 双氰胺 咪唑 酸酐 微胶囊 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]