Sn-9Zn-0.1S/Cu焊点液固界面金属间化合物的生长动力学  

Growth kinetics of intermetallic compounds formation between liquid Sn-9Zn-0.1S solders and Cu substrates interface

作　　者：黄惠珍[1] 赵亚楠[1] 彭如意 段远德 HUANG Huizhen;ZHAO Yanan;PENG Ruyi;DUAN Yuande(Nanchang University,Nanchang 330031,China)

机构地区：[1]南昌大学

出　　处：《焊接学报》2019年第6期23-28,I0002,共7页Transactions of The China Welding Institution

基　　金：国家自然科学基金资助项目(51304121);江西省教育厅科技资助项目(GJJ14111)

摘　　要：采用扫描电镜和光学显微镜观察研究了230~260℃焊接温度范围内Sn-9Zn-0.1S/Cu焊点界面金属间化合物的结构及生长动力学.结果表明,在该焊点界面形成的化合物可分为两层:靠铜侧的是厚且平直的γ-Cu5Zn8化合物层;靠焊料侧的则为另一薄且呈扇贝、粒状的CuZn化合物层.提高钎焊温度及延长反应时间基本不改变Sn-9Zn-0.1S/Cu焊点界面金属间化合物的结构和成分,但会使形成的界面金属间化合物层厚度增加.γ-Cu5Zn8金属间化合物层的厚度与反应时间的平方根呈线性关系,表明其生长由扩散机制控制.根据阿伦尼乌斯公式,Sn-9Zn-0.1S/Cu焊点界面γ-Cu5Zn8金属间化合物层反应活化能为22.09kJ/mol.The microstructure and growth kinetics of intermetallic compounds formed during the soldering reactions between Sn-9Zn-0.1S solders and Cu substrates at various temperatures ranging from 230 to 260 ℃ were investigated using scanning electron microscope and optical microscope.The results indicate that a thick planar layer of γ-Cu5Zn8 next to Cu substrate and a thin particulate layer of CuZn adjacent to solder can be formed at the Sn-9Zn-0.1S/Cu interface, and the constituent of the interfacial intermetallics do not change with the increase of soldering temperature and the prolonged reaction time, while the thickness of γ-Cu5Zn8 layer increases with the soldering temperature and reaction time. The relationship between the thickness of γ-Cu5Zn8 layer and the square root of reaction time fits linear, which shows that the growth of the intermetallic layer is diffusion-controlled.Kinetics analysis indicated that the activation energy of the intermetallic growth was 22.09 kJ/mol.

关 键 词：无铅钎料 锡锌 金属间化合物 钎焊温度 反应活化能 

分 类 号：TG425[金属学及工艺—焊接]