白光LED器件封装热态流明维持率研究  

Study on the maintenance rate of hot state lumen in white LED device packaging

作　　者：潘利兵 PAN Li-bing(Research and Development Center,Foshan NationStar Optoelectronics Co.Ltd.,Foshan 528000,China)

机构地区：[1]佛山市国星光电股份有限公司研发中心

出　　处：《佛山科学技术学院学报（自然科学版）》2019年第3期23-26,共4页Journal of Foshan University(Natural Science Edition)

摘　　要：论述了LED封装材料对白光器件热态流明的影响,对LED芯片、荧光粉、粘合剂、支架等材料进行研究,分析LED材料对器件热态光效的影响效果。国际上LED灯具在热态下光通的流明值有最低的要求,研究LED封装材料和工艺对热态流明维持率的影响,使LED器件在热平衡态时有效的光通更高,可以提升LED器件的封装技术水平,对于未来LED封装具有指导意义。This article discusses the influence of LED packaging materials of white LED devices thermal lumens, effect analysis of LED chip, phosphor, adhesive and bracket material effect on the device of thermal light efficiency. Internationally, LED luminaire has the lowest requirement for luminous flux in hot state. Therefore, the study of the influence of LED packaging materials and technology on the maintenance rate of hot state lumen can not only improve the packaging technology level of LED devices, but also have a guiding significance for future LED packaging.

关 键 词：白光LED 封装 热态流明 冷热比 材料 结构 

分 类 号：TN312[电子电信—物理电子学]