构建以芯片应用为导向的协同发展新生态  

Study on Constructing a New Ecology of Cooperative Development Oriented by Chip Application

作　　者：周宇 ZHOU Yu(Shanghai Tanghui Electronics Co.,Ltd, Shanghai 201401,China)

机构地区：[1]上海唐辉电子有限公司,上海201401

出　　处：《集成电路应用》2019年第9期34-36,共3页Application of IC

基　　金：上海市科技企业科技创新课题项目

摘　　要：基于中国集成电路产业的发展状况,分析中国对于创新能力的要求随着全球化不断发展和科学技术快速进步也在越来越高,创新主体与其他主体、客体、组织之间的合作倾向同样也变得越发明显。研究以应用为导向,围绕需求,分解目标,协同合作的方法,最终满足需求。Based on the development of integrated circuit industry in China, the requirement of innovation ability is becoming higher and higher with the continuous development of globalization and rapid progress of science and technology, and the tendency of cooperation between innovators and other subjects, objects and organizations is also becoming more and more obvious. This paper studies the application-oriented, demand-oriented, target decomposition, collaborative methods, and ultimately meet the needs.

关 键 词：集成电路 微电子 协同发展 创新能力 

分 类 号：TN409[电子电信—微电子学与固体电子学]