多层LCP基板中铜浆垂直互连射频特性的研究  

Radio frequency characteristics of copper slurry vertical interconnection in multilayer LCP substrate

作　　者：刘维红 康昕 张博 吴思诚 刘鹏程 LIU Weihong;KANG Xin;ZHANG Bo;WU Sicheng;LIU Pengcheng(School of Electronic Engineering, Xi'an University of Posts and Telecommunications, Xi??an 710121, China;The No. 771 Institute of the Ninth Institute of China Aerospace Science and Technology Corporation, Xi'an 710054, China)

机构地区：[1]西安邮电大学 电子工程学院,陕西 西安 710121 [2]中国航天科技集团公司第九研究院第七七一研究所,陕西 西安 710054

出　　处：《电子元件与材料》2019年第9期87-93,共7页Electronic Components And Materials

基　　金：国防科工局“十三五”国防基础科研项目(JCKY2016203C081);陕西省教育厅服务地方产业化专项(15JF029)

摘　　要：液晶高分子聚合物(Liquid Crystal Polymer,LCP)因其良好的射频特性近年来被广泛应用于射频电路系统集成。但是由于LCP作为一种新型的集成材料,盲埋孔技术实现困难,难以制作多层板结构。前期研究表明,利用铜浆互连工艺,可实现多层LCP基板中异面信号之间的电连接。本文进一步证明了铜浆互连结构良好的射频传输特性,LCP多层板内CPWG-SL结构的测试结果表明,在DC^1GHz内,其插入损耗优于-0.5dB,回波损耗优于-10dB,射频传输性能良好。同时,对中垂直通孔产生的寄生参数进行理论计算,建立了其等效电路模型。Recently, liquid crystal polymer (LCP) has been widely used in RF circuit system integration due to its good performance in radio frequency. However, it is difficult to fabricate the blind buried hole in this material, which limits its applicability in the multi-layer board structure. Previous studies indicated the copper paste process could be used to connect different layers in the multi-layer structure. In order to extend the frequency to radio frequency range, a CPWG-SL structure based on LCP materials was proposed, and the test results show that the RF transmission performance is good within DC-1 GHz, the insertion loss is better than - 0. 5 dB, the return loss is better than -10 dB. Meanwhile, the parasitic parameters of the structure of LCP multilayer were calculated theoretically, and its equivalent circuit model was established.

关 键 词：多层LCP技术 铜浆互连 垂直互连结构 等效电路 射频特性 

分 类 号：TN45[电子电信—微电子学与固体电子学]