MEMS单晶硅加热雾化芯片设计与制作  

Design and fabrication of MEMS monocrystalline silicon hotplate chip for atomization

作　　者：韩熠 宋凤民 李廷华 陈李 吴俊[1] 朱东来 HAN Yi;SONG Fengmin;LI Tinghua;CHEN Li;WU Jun;ZHU Donglai(Research & Development Center,China Tobacco Yunnan Industrial Co Ltd ,Kunming 650202 ,China;Key Disciplines Laboratary of Novel Micro-nano Devices and System Technology ,Chongqing University, Chongqing 400044 , China;Key Laboratory of Optoelectronic Technology & Systems of Ministry of Education, Chongqing University, Chongqing 400044 , China)

机构地区：[1]云南中烟工业有限责任公司技术中心,云南昆明650202 [2]重庆大学新型微纳器件与系统重点学科实验室,重庆400044 [3]重庆大学光电技术及系统教育部重点实验室,重庆400044

出　　处：《传感器与微系统》2019年第10期67-69,共3页Transducer and Microsystem Technologies

基　　金：云南中烟工业有限责任公司新型烟草产品开发前沿技术研究项目(2017XY01);重庆市重点产业共性关键技术创新专项(CSTC2016ZDCY—ZTZX20003);中央高校基本科研业务费(106112017CDJPT120002)

摘　　要：为实现高粘度液体的雾化,提出一种微机电系统(MEMS)单晶硅快速加热雾化芯片。对单晶硅加热芯片结构进行了设计,芯片为10 mm×10 mm的方形,布置了168个边长为500μm的方形雾化孔。通过ANSYS有限元软件进行了电-热耦合仿真,以评估其温度分布均匀性。衬底采用5×10^-3Ω·cm的4 in(l in=2.54 cm)N型(100)硅片,基于各向异性湿法腐蚀工艺完成了微孔阵列和芯片的制造。测试结果表明:室温下芯片电阻约为0.6Ω,且电阻值与温度呈正相关;芯片温度分布均匀,最低温与最高温相差约12.7%;施加3.7 V电压时,芯片在4 s内可升温至300℃,能够实现对甘油的快速雾化。该芯片结构和制作工艺简单,易于实现批量制造。A micro-electro-mechanical system(MEMS)monocrystalline silicon hotplate is proposed for rapid atomization of high-viscosity liquid.The structure of this chip is designed,whose area is 10 mm×10 mm with 168 500 μm×500 μm atomization holes.The electro-thermal coupling simulation is carried out using ANSYS FEA software,to evaluate the uniformity of temperature distribution.The microporous array and the whole chip are fabricated through anisotropic wet etching process based on 4-inch N-type(100)wafer,whose resistance rate is about 5×10^-3Ω·cm.The test results show that:the resistance value is about 0.6 Ω at room temperature and positively correlated with temperature;the temperature distribution of chip is uniform and the difference between the lowest and the highest temperature is about 12.7 %;the temperature can achieve 300 ℃ within 4 with 3.7 V and the glycerin can be quickly atomized.The structure and fabrication process of the chip are very simple and it is easy to be batch manufactured.

关 键 词：微机电系统 雾化 高粘度液体 加热芯片 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置] TN305[自动化与计算机技术—控制科学与工程]