极限温变下In60Pb40和Sn63Pb37焊点可靠性  

Reliability of In60Pb40 and Sn63Pb37 Solder Joints under Extreme Temperature Change Conditions

作　　者：周强 李青 李立广 洪元[1] 周玥 周旭[1] ZHOU Qiang;LI Qing;LI Liguang;HONG Yuan;ZHOU Yue;ZHOU Xu(Space Star Technology Co.Ltd.,Beijing 100095,China;The 7th Military Representative Office in Beijing,Beijing 100095,China)

机构地区：[1]航天恒星科技有限公司,北京100095 [2]空装驻北京地区第七军事代表室,北京100095

出　　处：《电子工艺技术》2019年第5期256-260,共5页Electronics Process Technology

摘　　要：开展了In60Pb40焊料形成焊点在极限温变条件下(-100℃~100℃)可靠性的研究,并与Sn63Pb37焊料进行对比。不进行物理去除In60Pb40焊丝表面氧化层时,使用含卤素的助焊剂可实现其在镀金层上良好焊接。以物理方法去除焊料氧化层时,采取合适的工艺,利用R型或RMA型助焊剂可实现镀金层上的良好焊接。In60Pb40焊料与Ni/Au镀层反应后,界面形成了一层AuIn2的金属间化合物。使用Sn63Pb37在未去金的焊盘上焊接未去金的插针并进行极限温变试验后,焊点因“金脆”出现了裂纹,相同条件下,在去金的焊盘上焊接去金的插针焊点中无裂纹出现。使用In60Pb40焊料焊接插针,在极限温变试验后,焊点中出现了较多的细小微裂纹。Under the same conditions, no cracks appeared in the inserted needles on the non-degoldplated pads. The In60 Pb40 solder was used to weld the pins. After the limit temperature change test, many tiny cracks appeared in the solder joint.Under the same conditions, there was no crack in the gold-removed insert solder joint. After the limit temperature change test,The reliability of In60 Pb40 solder joints is studied under extreme temperature change conditions(-100 ℃^+100 ℃), and compared with Sn63 Pb37 solder joints. Good soldering on gold plating layer can be achieved by using halogen-containing flux without removing the oxide layer on the surface of the wire. Under the condition of removing the oxide layer on the surface of solder by physical means, the R-type or RMA-type flux can also achieve good soldering on the gold plating layer by appropriate process. After the reaction of In60 Pb40 solder with the Ni/Au plating, an intermetallic compound of AuIn2 is formed at the interface. Using Sn63 Pb37 to solder Au-plated pins on the Ni/Au pads and carrying out the extreme temperature change test, the solder joints cracked due to "gold fragility". Under the same conditions, no cracks appeared in the solder joints of the gold-removed pins soldered on the gold-removed Ni/Au pads. After the extreme temperature change test, a lot of tiny cracks appeared in the solder joints when the pins was soldered with In60 Pb40 solder.

关 键 词：In60Pb40焊料 极限温变条件 AuIn2 微裂纹 

分 类 号：TN60[电子电信—电路与系统]