玻璃纤维化学镀铜工艺条件的优化研究  

Condition Optimizing of Electroless Copper Plating for Glass Fiber

作　　者：张海涛[1] 陈莉云[1] 王亚龙[1] 王旭辉[1] 张利兴[1] 缪云坤[2] 金宝源[2] 

机构地区：[1]西北核技术研究所,陕西西安710024 [2]防化研究院,北京102205

出　　处：《材料保护》2002年第10期50-52,共3页Materials Protection

摘　　要：通过正交实验优化了玻璃纤维化学镀铜的工艺条件 ,研究了提高镀液稳定的方法 ,同时对导电玻璃纤维的电阻率、镀层成分等参数进行了分析。研究表明 ,玻璃纤维化学镀铜后 ,可提高导电性能 ,并用作制备电磁屏蔽材料。The process conditions of electroless copper plating for glass fiber were optimized by orthogonal tests. The method to improve the stability of solution was studied, and the quality characters of plated glass fiber as the resistivity and composition were also measured. Results showed that the conductive performance of glass fiber with copper plating increased greatly so that the material could use as electromagnetic shield.

关 键 词：玻璃纤维 化学镀铜 工艺条件 优化 研究 镀液 稳定性 纤维性能 

分 类 号：TQ153.1[化学工程—电化学工业]