电镀锡板表面抗划伤性的研究Ⅱ.软熔工艺对电镀锡板表面抗划伤性的影响  

Study on the Scratch Resistance of Tinplate Surface Ⅱ. Effect of Reflow Technology on the Scratch Resistance of Tinplate

作　　者：刘小兵[1] 成旦红[1] 王徐承[2] 郁祖湛[2] 钱钢[3] 

机构地区：[1]上海大学化学系,上海200436 [2]复旦大学化学系,上海200433 [3]宝山钢铁股份有限公司,上海200941

出　　处：《电镀与精饰》2002年第6期1-4,7,共5页Plating & Finishing

摘　　要：移植 QHQ型涂膜铅笔划痕硬度仪用来测试电镀锡板的抗划伤性。用此方法研究了软熔处理以及不同软熔方式对电镀锡板抗划伤性的影响 ,实验结果表明 :软熔处理对薄镀锡板可以提高镀锡板表面抗划伤性 ,在电阻软熔基础上增加感应软熔后 ,在一定条件下可以进一步提高电镀锡板的抗划伤性 ,并从理论上进行了初步探讨。通过对电镀锡板表面形貌观察结果表明 。The scratch resistance of tinplate was measured by using modified QHQ type pencil hardness test apparatus which is designed for organic paint coating. The effect of reflow treatment and different reflow type on the scratch resistance of tinplate was studied. It was found that resistance reflow treatment, to some extent, can improve the quality of scratch resistance of thin coating tinplate. Furthermore, the results obtained also show that adding induction reflow on resistance reflow can further increase the scratch resistance of the tinplate surface. The data obtained indicate that the scratch resistance of tinplate surface relates to the crystal grain size and compactness of the surface tin layer. The possible mechanism of the effect of induction reflow on the scratch resistance was proposed.

关 键 词：电镀 锡板 表面抗划伤性 研究 软熔工艺 电阻软熔 感应软熔 划痕硬度 

分 类 号：TQ335.22[化学工程—橡胶工业] TQ153.13