制备工艺对Ag/SnO_2电接触材料抗熔焊性能影响  被引量:4

Effects of preparation processing on anti-welding properties of Ag/SnO_2 contact materials

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作  者:刘松涛[1] 曹风[1] 王俊勃[1] 思芳 杨敏鸽[1] 

机构地区:[1]西安工程大学机电工程学院,陕西西安710048

出  处:《纺织高校基础科学学报》2015年第4期510-514,521,共6页Basic Sciences Journal of Textile Universities

基  金:陕西省教育厅科学研究计划自然科学专项资助项目(14JK1314)

摘  要:为了研究制备工艺对Ag/SnO_2电接触材料抗熔焊性能的影响,采用粉末冶金工艺制成银含量92%的掺杂Ag/SnO_2电接触材料,将制得电接触材料与商用内氧化工艺制备银含量92%的Ag/SnO_2电接触材料配对,在63A交流电流条件下进行抗熔焊性能测试.同时,利用扫描电子显微镜(SEM)、X射线能谱仪(EDS)、X射线衍射仪(XRD)等对电接触材料性能和熔焊前、后微观组织进行了表征.结果表明:粉末冶金工艺制得的电接触材料中氧化物颗粒更细小,在银基体上分布更均匀;熔焊测试后氧化物在银基体中分布均匀,同时没有出现单一氧化物偏聚.而内氧化工艺制得的电接触材料中银基体沿(111)晶面出现择优生长;熔焊测试后氧化物和银基体分离,锡元素和铟元素分别形成偏聚.In order to explore the effect of preparation process on the welding properties of Ag/SnO2 contact materials ,the doped Ag/SnO2 contact material with silver content 92% was prepared by powder metallurgy process .Firstly ,the anti‐welding performance test was done between the doped Ag/SnO2 contact material and commercial Ag/SnO2 contact material with silver content 92% made by internal oxidation process under 63AC .Secondly ,the microstruc‐tures of contact materials were characterized with SEM ,EDS and XRD before and after the w elding performance ,respectively .T he results show that the oxides become smaller tinier and are more evenly distributed in the contact materials prepare by powder metallurgy process and that oxides are evenly distributed and no single oxide is segregated in the contact materials after the welding test .But the silver in contact materials made by internal oxidation process grows preferentially along the (111) crystal face .The oxide and the silver are kept apart after the welding test ,and the tin and the indium element are segregated respectively .

关 键 词:粉末冶金 内氧化 Ag/SnO2电接触材料 抗熔焊 

分 类 号:TM501.3[电气工程—电器]

 

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