BLE-1光亮低温化学镀镍层的性能  

Deposit Characteristics of BLE-1 Bright Electroless Nickel Plating Process at Low Temperature

作　　者：方景礼[1] 叶向荣[1] 辛建树 方晶[1] 

机构地区：[1]南京大学应用化学研究所,210018

出　　处：《材料保护》1992年第1期7-11,共5页Materials Protection

摘　　要：用扫描电镜、X-射线衍射仪、显微硬度测定仪、多功能可焊性测试仪、X-射线光电子能谱(XPS)和俄歇电子能谱(AES)研究了BLE-1低温光亮化学镀Ni-P层的形貌、结构、硬度、钎焊性、组成元素及其深度分布以及组成元素的价态等镀层性能。结果表明,镀态的Ni-P镀层是由金属镍和少量Ni_2P组成,它不完全是非晶态。在350℃热处理1h后它转变为晶态镍和Ni_3P,并显示最高的显微硬度。Ni-P镀层的钎焊性随镀层磷含量的增加和镀液pH值的降低而下降。当用YH-61有机胺改性助焊剂时Ni-P层的钎焊性最好,3S时的润湿力可达80％。XPS和AES的结果表明,镀层中磷和镍均呈零价态,其结合能分别为129.1eV和852.3eV。从AES深度分布曲线的组成恒定区求得镀层的元素组成为:Ni 85.4％,P 10.1％,O 4.5％。The morphology, structure, composition and its depth profiles, hardness, solderability and valence states of the composite elements of the BLE-1 electroless Ni-P deposite were studied with XPS, AES, SEM, XRD and universal solderability tester. The results showed that BLE-1 electroless Ni-P deposit in as-deposited condition was composed of metal Ni and a few amount of Ni_2 P, and was not entirely crystal,but transformed into crystal metal Ni and Ni_3P thereafter. The microhardness reached its peak value after 350℃ heating for 1h. The solder ability of BLE-1 Ni-P deposit decreased with the increase of p content, The most force at 3 s could reach 80% when YH-61 water soluble flux improved by organic amine was used. XPS results showed that the P and Ni in Ni-P deposit were zero valence state and their bonding energies were 129. 1 ev and 852.3 eV respectively. The composition (A. C. %) of the Ni-P deposit was Ni 85.4% P 10.1% O 4.5% from the constant composition region of the depth profile curves.

关 键 词：化学镀 低温 镀镍 镀层 

分 类 号：TQ153.12[化学工程—电化学工业]