微波组件大面积基板钎焊工艺研究  

Research on Large Area Soldering Process of Substrates for Microwave Modules

作　　者：吴昱昆 王禾 任榕[1] WU Yukun;WANG He;REN Rong(The 38th Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第三十八研究所

出　　处：《电子工艺技术》2019年第4期192-196,219,共6页Electronics Process Technology

基　　金：装备发展十三五预研项目(41423070203,41423010103)

摘　　要：现代微波组件高集成、高功率和宽频段的发展方向对组件内元器件的接地和散热性能提出了更高要求,其中对组件中的电路基板要求具有更高的钎透率和更低的热阻。然而,电路基板的大面积钎焊一直受助焊剂残留和钎透率不足等问题困扰。针对常规大面积基板钎焊工艺进行了对比研究和分析,进一步提出了大面积基板的新型真空回流焊接工艺。该工艺可有效解决基板钎焊过程中的助焊剂残留和钎透率不足难题,将基板钎焊的钎透率提升到了95%以上,有效保障了大面积基板的高可靠钎焊。The development of modern microwave modules with high integration,high power and high bandwidth give higher requirements for the properties of grounding and heat dissipation of the components in the modules,in which the circuit substrates require higher soldering penetration rate and lower thermal resistance.However,the soldering quality of large area substrate has been plagued by problems of the flux residue and the low soldering penetration rate.Conventional large area soldering processes of substrates were compared and studied,and a new type of vacuum reflow soldering process for the large area soldering was proposed.This process can efficiently solve the problems of the flux residue and the insufficient soldering penetration rate,and increase the soldering penetration rate of substrates to more than 95%,which ensures the high reliability soldering of the large area substrates.

关 键 词：微波组件 大面积钎焊 电路基板 钎焊工艺 

分 类 号：TN605[电子电信—电路与系统]