电源高导热材料性能的研究  

Study on Performance of High Thermal Conductivity Laminate PCB

作　　者：安维[1] 王志坚[1] 曾福林[1] 陈丽霞 李敬科[1] AN Wei;WANG Zhijian;ZENG Fulin;CHEN Lixia;LI Jingke(Zhongxing Telecommunication Equipment Corporation,Shenzhen 518057,China;China CEPREI Labs,Guangzhou 510610,China)

机构地区：[1]中兴通讯股份有限公司,广东深圳518057 [2]中国赛宝实验室,广东广州510610

出　　处：《电子工艺技术》2019年第4期210-212,223,共4页Electronics Process Technology

基　　金：广东省科技计划项目(2017B090903006)

摘　　要：电源PCB一般应具备良好的散热性,对材料的导热性及铜厚都有较高的要求。随着电源设备向小型化和多功能化方向的发展,传统的厚铜设计已经不能满足电源的散热要求,而铜基和铝基设计在成本上又不具有优势,于是对电源高导热材料的需求越来越强烈。着重研究了利用高导热厚铜材料进行电源PCB加工的可能性,为产品的研发设计提供参考。The power supply PCB should generally have good heat dissipation,so it has high requirements for the thermal conductivity and copper thickness of the material.With the miniaturization and multi-functional development of power supply equipment,the traditional thick copper design can not meet the heat dissipation requirements of the power supply.While the copper-based and aluminum-based designs do not have the advantage in cost,so there is a growing demand for high thermal conductivity materials for the power supply.The possibility of power PCB processing with high thermal conductivity thick copper material was studied,which can provide reference for product R&D design.

关 键 词：PCB 高导热材料 电源 

分 类 号：TN604[电子电信—电路与系统]