基于焊点模型的通孔回流焊模板设计  

Design of Through-hole Reflow Soldering Stencil Based on Solder Joint Model

作　　者：杨唐绍 张红兵[1] 黎全英[1] YANG Tangshao;ZHANG Hongbing;LI Quanying(The 30th Research Institute of CETC,Chengdu 610041,China)

机构地区：[1]中国电子科技集团公司第三十研究所

出　　处：《电子工艺技术》2019年第4期213-215,240,共4页Electronics Process Technology

基　　金：十三五XX联合基金项目(6141B08120302)

摘　　要：小型化和高集成化的SMT器件与插装件混装的PCBA采用通孔回流焊接工艺可以起到提高生产效率的作用。分析了插装件焊点焊膏量的数学模型,提出了采用阶梯模板的方法控制插装件焊膏量。根据焊点数学模型设计几组数据验证模板厚度的快速设计方法,为通孔回流焊中插装件焊接的质量控制提供了参考。The mixed PCBA of miniaturized and highly integrated SMT and THT can play a role in improving the efficiency of production by through-hole reflow process.The mathematic model of solder paste quantity in solder joint was analyzed,the method of using stepstencil to control the solder paste quantity for THT was put forward.Based on the mathematical model of solder joint,several groups of data were designed to verify the rapid design method of stepstencil thickness,which provides a reference for the quality control of THT in through-hole reflow soldering.

关 键 词：通孔回流焊 焊点数学模型 阶梯模板 模板厚度设计 焊接验证 

分 类 号：TN605[电子电信—电路与系统]