PCBA返修工艺的核心与常见问题  

Core and Common Problems of PCBA Repair Process

作　　者：王剑[1] 聂富刚 贾忠中[1] WANG Jian;NIE Fugang;JIA Zhongzhong(Zhongxing Telecommunication Equipment Corporation,Shenzhen 518057,China)

机构地区：[1]中兴通讯股份有限公司

出　　处：《电子工艺技术》2019年第4期245-248,共4页Electronics Process Technology

摘　　要：现代电子产品向多功能、微型化和高密度方向发展,通讯网络产品上使用越来越多的细间距器件,间距最小到0.4 mm,同时一些核心器件(如CPU)的尺寸越来越大,从55 mm到80 mm。用常规的返修工艺,出现合格率差和效率低,甚至无法返修的情况。从工程应用的问题出发,对当前系统单板中的返修难题进行分析研究,并针对问题提供解决办法。Modern electronic products are developing towards multi-function,miniaturization and high density.More and more fine-pitch devices are used on communication network products,with the pitch as small as 0.4 mm,and some core devices(such as CPU)are getting larger and larger in size,ranging from 55 mm to 80 mm.With the conventional repairing process,the qualified rate is poor,the efficiency is low,and even the repairing can not be done.Starting from the problems of Engineering application,the problems of veneer repairing were analysed and studied in the current system,and solutions to these problems were provided.

关 键 词：细间距 高密度 大尺寸单板 返修 

分 类 号：TN605[电子电信—电路与系统]