Sn-Ag系无铅钎料研究进展  

Research status of Sn-Ag lead-free solders

作　　者：全盛凯 张亮 熊明月[2] 赵猛 QUAN Shengkai;ZHANG Liang;XIONG Mingyue;ZHAO Meng(JSNU-SPBPU Institute of Engineering,Jiangsu Normal University,Xuzhou 221116,China;School of Mechat-ronic Engineering,Jiangsu Normal University,Xuzhou 221116,China;State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001,China)

机构地区：[1]江苏师范大学江苏圣理工学院,江苏徐州221116 [2]江苏师范大学机电工程学院,江苏徐州221116 [3]哈尔滨工业大学先进焊接与连接国家重点实验室,黑龙江哈尔滨150001

出　　处：《电焊机》2019年第9期6-18,共13页Electric Welding Machine

基　　金：国家自然科学基金资助项目(51475220);中国博士后科学基金资助项目(2016M591464);江苏省“六大人才高峰”资助项目(XCL-022);江苏省“青蓝工程”中青年学术带头人计划资助;先进焊接与连接国家重点实验室开放课题重点项目(AWJ-19Z04)

摘　　要：简述近年来国内外Sn-Ag系无铅钎料的研究现状,着重探讨Bi、In、Zn、Al、Cu、Ni、Sb等合金元素、稀土元素、纳米颗粒对Sn-Ag系无铅钎料的润湿性能、熔化特性、力学性能、显微组织以及界面组织的影响,同时对Sn-Ag系无铅钎料研究过程中存在的问题进行了探讨并提出相应的解决方法,为Sn-Ag系无铅钎料的研究提供参考。The investigation status of Sn-Ag lead-free solders Is reviewed comprehensively.The effects of Bi,In,Zn,Al,Cu,Ni,Sb et al rare earths and nanoparticles on the wetting properties,melting temperature,mechanical properties,microstructure and interfacial reactions are discussed.In addition,the problems in the study of Sn-Ag solders are discussed and solutions are proposed.It provides a reference for the research of Sn-Ag lead-free solder.

关 键 词：无铅钎料 Sn-Ag合金 综述 显微组织 力学性能 

分 类 号：TG425[金属学及工艺—焊接]