SnCu0.7无铅焊料抗氧化性能研究  

Study on Oxidation Resistance of SnCu0.7 Lead-free Solder

作　　者：卢红波 李文婷 刘庆富 汤建所 任俊 LU Hong-bo;U Wen-ting;LIU Qing-fu;TANG Jian-suo;REN Jun(Yunnan Tin and Materials Co.,Ltd.,Kunming 65050,China;Yunnan Tin Chenzhou Mining&Metallurgy Co.Ltd.,Chenzhou 423000,China;School of Materials Science and Engineering.Central South University,Changsha 410083,China)

机构地区：[1]云南锡业锡材有限公司,云南昆明650050 [2]云南锡业郴州矿冶有限公司,湖南郴州423000 [3]中南大学材料科学与工程学院,湖南长沙410083

出　　处：《湖南有色金属》2019年第5期36-39,共4页Hunan Nonferrous Metals

摘　　要：无铅焊料抗氧化性能差已经成为钎焊行业的共性问题。以SnCu0.7无铅焊料为研究对象,向钎料中添加微量元素P和Ge改善其抗氧化性能,并采用模拟波峰焊进行动态氧化渣渣率测试。试验结果表明:当SnCu0.7无铅焊料中添加100ug/g的P元素时,其动态氧化渣渣率为0.409%,连续波峰测试抗氧化失效时间为56~64h。SnCu0.7无铅焊料中添加P与Ge相比较,前者的抗氧化性能更优,而且成本更低。Lead-free solder had a poor property in oxidation resistance,which has become a common problem in welding industry.In this paper,SnCu0.7 lead-free solder was studied by adding the microelement of P and Ge to improvel the oxidation resistance,and the dynamicoxidation slag rate was measured by simulated wave-soldering.The test results show that while the P content of SnCu0.7 lead-free solder was 100 μg/g,the dynamic oxidation slag rate was 0.409%,and the oxidation resistance failure time of continuous wave-soldering test was 56~64 h.Comparison the addition of P with the addition of Ge in SnCu0.7 lead-free solder,the oxidation resistance of the former is better,and has lower cost.

关 键 词：无铅 焊料 抗氧化性能 波峰焊 

分 类 号：TG425[金属学及工艺—焊接]