各向异性湿法刻蚀中刻蚀温度对硅尖形貌的影响  

Effect of Etching Temperature on the Shape of Silicon Tip in Anisotropic Wet Etching

在线阅读下载全文

作  者:张小辉 胡亚明 梁军生[1,2] 宿世界 王大志[2] ZHANG Xiaohui;HU Yaming;LIANG Junsheng;SHU Shijie;WANG Dazhi(Key Laboratory for Micro/Nano Technology and System,Liaoning Province,Dalian University of Technology,Dalian 116024,China;Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education,Dalian University of Technology,Dalian 116024,China)

机构地区:[1]大连理工大学辽宁省微纳米技术及系统重点实验室,辽宁大连116024 [2]大连理工大学精密与特种加工技术教育部重点实验室,辽宁大连116024

出  处:《机电工程技术》2019年第9期35-37,共3页Mechanical & Electrical Engineering Technology

基  金:国家自然科学基金资助项目(编号:51675085;51475081)

摘  要:纳米硅尖在原子力学显微镜、微机械电子、光学研究、纳米级图形加工上具有广泛的用途。然而,如何制备小曲率半径高纵横比的硅尖仍为有待解决的问题和挑战。根据各项异性湿法刻蚀硅尖原理,设计了硅尖的加工工艺流程,并制备出不同纵横比的纳米硅尖。通过观察掩模对角线刻蚀进程,得到了掩模对角线刻蚀速率与刻蚀温度的关系;对比了不同刻蚀温度对刻蚀硅尖的影响,发现采用40wt%KOH刻蚀液,水浴78℃的刻蚀条件满足自锐化且刻蚀出纳米硅尖曲率半径小而纵横比大,其曲率半径为26 nm,纵横比为1.9。Nano-silicon tips have a wide range of applications in atomic force microscopy,micromechanical electronics,optical research,and nanoscale pattern processing.However,how to fabricate a silicon tip with a small radius of curvature and a high aspect ratio remains a problem and challenge.According to the principle of isotropic wet etching silicon tip,the processing process of silicon tip is designed,and nanometer silicon tips with different aspect ratios are prepared.By observing the diagonal etching process of the mask,the relationship between the diagonal etching rate of the mask and the etching temperature is obtained.Comparing the effects of different etching temperatures on the etched silicon tip,it was found that the etching condition of 40wt%KOH was used,and the etching condition of the water bath at 78°C satisfied the self-sharpening and the etched nano-silicon tip had a small radius of curvature and a large aspect ratio,and the radius of curvature was 26 nm,and the aspect ratio was 1.9.

关 键 词:单晶硅 针尖 各向异性刻蚀 

分 类 号:TN305[电子电信—物理电子学]

 

参考文献:

正在载入数据...

 

二级参考文献:

正在载入数据...

 

耦合文献:

正在载入数据...

 

引证文献:

正在载入数据...

 

二级引证文献:

正在载入数据...

 

同被引文献:

正在载入数据...

 

相关期刊文献:

正在载入数据...

相关的主题
相关的作者对象
相关的机构对象