LCP系统集成技术中一种新型的垂直互连工艺  

A Novel Vertical Interconnect Transition in LCP System Integration Technology

作　　者：刘维红 康昕 杨春艳 刘鹏程 LIU Weihong;KANG Xin;YANG Chunyan;LIU Pengcheng(School of Electronic Engineering,Xi'an University of Posts and Telecommunications,Xi'an,710121,CHN;The Seventh Institute of the Ninth Institute of China Aerospace Science And Technology Corporation,Xi'an,710054,CHN)

机构地区：[1]西安邮电大学电子工程学院,西安710121 [2]中国航天科技集团公司第九研究院第七七一研究所,西安710054

出　　处：《固体电子学研究与进展》2019年第5期386-389,共4页Research & Progress of SSE

基　　金：国防基础科研项目(JCKY2016203C081)

摘　　要：液晶高分子聚合物(Liquid crystal polymer,LCP)作为一种新型的射频电子基板,广泛应用于射频电路系统集成。为了实现系统的小型化,垂直互连工艺被广泛用于异面信号之间的相互传输系统。但是LCP作为一种新型的集成工艺,在制作过程中难以实现盲埋孔技术。本文提出了一种用于LCP系统集成技术的新型垂直互连工艺,通过在上层基板底部和底部基板金属表层制作焊盘,在粘合层中利用铜浆互连结构,实现了LCP基板中异面信号之间的垂直互连。测试结果证明了该结构的电连接性良好。As a new type of RF electronic substrate,Liquid Crystal Polymer(LCP)was widely used in RF integrated circuit system.In order to realize the miniaturization of system,vertical interconnect technology was widely used in signal transmission system between different planes.However LCP as a new type of integration process,it was difficult to realize blind buried hole technology in production process.A new vertical interconnection technology is proposed in the LCP system integration technology in this paper.The vertical interconnection between different signals in the LCP substrate is realized by fabricating pads on the bottom and metal surface of the upper substrate and using copper interconnection structure in the adhesive layer.The test results show that the structure has good electrical connectivity.

关 键 词：LCP技术 系统集成 铜互连 

分 类 号：TN45[电子电信—微电子学与固体电子学]