二次集成的高压驱动电路的研制  

Development of High Voltage Drive Circuit with Secondary Integration

作　　者：邢变丽 XING Bian-li(Shaanxi Huajing Microelectronics Co.,Ltd.,Xi'an 710065,China)

机构地区：[1]陕西华经微电子股份有限公司

出　　处：《通信电源技术》2019年第11期29-31,共3页Telecom Power Technology

摘　　要：针对厚膜混合集成高压驱动电路进行理论分析,对产品在批量化生产过程存在的问题、解决措施以及持续改进过程的技术进行总结,介绍该产品的电路、结构及失效产品的原因和解决方案,论证了高压驱动电路批量化和高可靠的设计原则。Based on the theoretical analysis of the thick film hybrid integrated high voltage drive circuit,the problems in the mass production process,the solutions and the continuous improvement technology are summarized.This paper introduces the circuit,structure of the product,the reason and solution of the failure product,and further demonstrates the design principle of batch high voltage drive circuit and high reliability.

关 键 词：高压驱动电路 厚膜混合集成 产品可靠性 

分 类 号：TP3[自动化与计算机技术—计算机科学与技术]