Co56Ta35B9非晶合金薄膜纳米压痕蠕变行为研究  

Nano-indentation Creep Behavior of a Co56Ta35B9 Metallic Glass Film

作　　者：马昕迪 李培友[2] 王刚[1] MA Xindi;LI Peiyou;WANG Gang(School of Materials Science and Engineering,Shanghai University,Shanghai 200444,China;School of Materials Science and Engineering,Shaanxi University of Technology,Hanzhong Shanxi 723001,China)

机构地区：[1]上海大学材料科学与工程学院,上海200444 [2]陕西理工大学材料科学与工程学院,陕西汉中723001

出　　处：《上海金属》2019年第6期39-43,共5页Shanghai Metals

摘　　要：在不同衬底温度(298、373和473 K)下,采用磁控溅射法在玻璃衬底上成功制备了Co 56 Ta 35 B 9非晶合金薄膜。利用纳米压痕技术研究了非晶合金薄膜的蠕变行为。结果表明:薄膜的模量和硬度随衬底温度的升高而升高。随着衬底温度的升高,薄膜在蠕变过程中的应变速率敏感指数降低,蠕变抗力增大,剪切转变区体积缩小,塑性降低。采用纳米压痕保载阶段的数据拟合延迟谱,发现衬底温度越高,对应的延迟谱的峰强越低,说明原子排列均匀,从而解释了其模量和硬度提高的原因。Co 56 Ta 35 B 9 metallic glass films were fabricated on glass substrates using magnetron sputtering at different substrate temperatures(298 K,373 K and 473 K).The creep behavior of metallic glass film was studied by nano-indentation technique.The results showed that the modulus and hardness of the films increased with the increase of the substrate temperature;and that with the increase of substrate temperature,the strain rate sensitivity exponent decreased during creep,resulting in larger creep resistance,smaller volume of shear transition zone and lower plasticity.By fitting the delay spectrum with the data of nano-indentation holding stage,it was found that the higher the substrate temperature was,the lower the peak intensity of the corresponding delay spectrum was,which indicated that the atoms were uniformly arranged,thus explaining the reason for the increase in both modulus and hardness.

关 键 词：非晶合金薄膜 衬底温度 蠕变 应变速率敏感指数 剪切转变体积 

分 类 号：TG1[金属学及工艺—金属学]