无氰镀金进展概述  

Overview of Cyanide-free Gold Plating Progresses

作　　者：杨家强 金磊 杨防祖[1] 周绍民[1] YANG Jiaqiang;JIN Lei;YANG Fangzu;ZHOU Shaomin(State Key Laboratory of Physical Chemistry of Solid Surfaces,College of Chemistry and Chemical Engineering,Xiamen University,Xiamen 36100,China)

机构地区：[1]厦门大学化学化工学院固体表面物理化学国家重点实验室

出　　处：《电镀与精饰》2019年第12期35-43,共9页Plating & Finishing

基　　金：国家自然科学基金(21972118);创新群体项目(21621091)

摘　　要：氰化物镀金是目前广泛工业应用的工艺。本文介绍了一价金和三价金无氰镀金工艺研究进展,综述了无氰镀金体系的组成、操作条件、金沉积机制及优缺点,展望了无氰镀金工艺的发展方向。Cyanide gold plating process is widely used in industrial applications at present. In this paper,research progresses of cyanide-free monovalent and trivalent gold plating are introduced. Composition,operating condition,gold deposition mechanism,advantage and disadvantage of cyanide-free gold plating system are summarized. The development of cyanide-free gold plating is discussed.

关 键 词：无氰 镀金 综述 Au(Ⅲ)镀金 

分 类 号：TQ1[化学工程]