5G大尺寸埋铜PCB的材料选择研究  

Research on Material Selection of 5G Large-size Embedded Copper PCB

作　　者：王志坚[1] 安维[1] 曾福林[1] 李敬科[1] WANG Zhijian;AN Wei;ZENG Fulin;LI Jingke(Zhongxing Telecommunication Equipment Corporation,Shenzhen 518057,China)

机构地区：[1]中兴通讯股份有限公司

出　　处：《电子工艺技术》2019年第6期320-323,共4页Electronics Process Technology

基　　金：广东省科技计划项目(2017B090903006)

摘　　要：随着5G通讯时代的到来,5G产品对于信号的完整性、板材可加工性及可靠性都有了很多新的要求。同时基于成本压力,国产板材愈加成熟,需要有一套系统的方法来筛选可用的5G板材。主要介绍了5G大尺寸埋铜PCB的材料选择方法。With the coming of the 5 G communication era,5 G products have many new requirements for signal integrity,process ability and reliability.Due to cost pressures,domestic boards become more mature,and a set of systematic methods is required to filter available 5 G boards.The material selection method of 5 G large-size embedded copper PCB is mainly introduced.

关 键 词：PCB 5G 表面处理 

分 类 号：TN604[电子电信—电路与系统]