有源相控阵天线瓦片式T/R组件焊料气密性研究  

Research on Gas Tightness for Solder of Active Phased Array Antenna Stacked T/R Modules

作　　者：王康[1] 王杰 杨宗亮 刘慧荣 赵飞[1] WANG Kang;WANG Jid;YANG Zongliang;LIU Huirong;ZHAO Fei(The 54th Research Institute of CETC,Shijiazhuang 050081,China;Hebei Branch of China Communication System Co.,Ltd.,Shijiazhuang 050081,China;Heibei Far-East Communication System Engineering Co.,Ltd.,Shijiazhuang 050035,China)

机构地区：[1]中国电子科技集团公司第五十四研究所,河北石家庄050081 [2]中华通信系统有限责任公司河北分公司,河北石家庄050081 [3]河北诺亚人力资源开发有限公司,河北石家庄050035

出　　处：《电子工艺技术》2019年第6期324-327,共4页Electronics Process Technology

基　　金：科工局装备发展预研项目(41423010609)

摘　　要：LTCC基板在有源相控阵天线瓦片式TR组件中,不仅具有电路功能,还具有结构支撑作用。Ferro基板由于材料本身的多孔结构,在压力作用下,表层一定厚度内吸附大量气体,但是这种表面吸附气体的行为并不影响密闭腔体内芯片组装的可靠性。使用Au80Sn20、Sn3.0Ag0.5Cu、Sn63Pb37三种焊料进行组件的气密性封装,无论是初始状态还是加速寿命试验后,三种焊料的气密性表现都满足标准的相关要求,但Sn基焊料产生大量的IMC,并且在时效过程中很容易产生柯肯达尔空洞,容易在界面处产生裂纹,影响气密性,因此,需要对镀层的成分、厚度等关键参数进行合理的优化控制。LTCC substrate has not only circuit function,but also structure support function in the stacked active phased array antenna.Due to the porous structure of Ferro substrate,a large amount of helium is adsorbed within a certain thickness of the surface under pressure,which has no effect on the reliability of micro-packaging in hermetic environment.Three kinds of solders,Au80Sn20,Sn3.0Ag0.5Cu and Sn63Pb37,are used for hermetic packaging of components,and the three solders can meet the relevant requirements of the standards no matter in the initial state or after accelerated life test.The IMC of Sn-rich solders grows rapidly,and it is easy to produce Kirkendall voids under aging which will lead to cracks along the interface and reduction of gas tightness,so the key parameters such as coating component and thickness need to be optimized.

关 键 词：瓦片式结构 有源相控阵天线 LTCC基板 气密性 

分 类 号：TN605[电子电信—电路与系统]