某仪器电控系统SB3控制箱热测试分析  

Thermal Test Analysis of SB3 Control Box of an Instrument Electronic Control System

作　　者：刘意 高军 王红涛 刘洋[3] 刘建南 LIU Yi;GAO Jun;WANG Hongtao;LIU Yang;LIU Jiannan(Guangdong Scientific Verification&Testing Engineering Technology Co.,Ltd.,Guangdong 510663,China;Zhongke(Shenzhen)Technology Service Co.,Ltd.,Shenzhen 518027,China;University of Electronic Science and Technology of China,Chengdu 611731,China)

机构地区：[1]广东科鉴检测工程技术有限公司,广东广州510663 [2]中科(深圳)科技服务有限公司,广东深圳518027 [3]电子科技大学,四川成都611731

出　　处：《现代信息科技》2019年第20期40-43,共4页Modern Information Technology

基　　金：国家重点研发计划——放射治疗装备可靠性与工程化技术研究：研发过程质量与可靠性保证与验证（项目编号：2017 YFC0108400）

摘　　要：在产品研发过程中,对产品进行环境试验,使其充分暴露潜在的设计、制造、装配等缺陷十分重要。本文通过对某仪器电控系统SB3控制箱进行热测试,获得SB3控制箱在常温条件下的热场分布,以及在特定环境温度下的各关键点温度;测试发现该SB3控制箱的多项潜在缺陷,并对其设计缺陷提出了相应的改进建议。通过改进有利于提升产品的固有可靠性与成熟度水平,从而提高用户满意度,减轻售后维修保障负担。In the product development process,it is very important to conduct environmental tests on the product to fully expose potential defects in design,manufacturing,and assembly. In this paper,the thermal test of the SB3 control box of an instrument electronic control system is carried out to obtain the thermal field distribution of the SB3 control box under normal temperature conditions and the temperature of each key point at a specific ambient temperature. The test found that the SB3 control box has multiple thermal potentials defects,and suggestions for improvement of its design flaws,through improvement will help improve the product’s inherent reliability and maturity level,thereby improving user satisfaction and reducing the burden of aftersales maintenance support.

关 键 词：SB3控制箱 热测试 潜在缺陷 

分 类 号：TP303.3[自动化与计算机技术—计算机系统结构]