装挂对微波电路板背面金层厚度及金盐消耗的影响  

Effects of racking methods on gold coating thickness and gold salt consumption on backside of microwave printed circuit board

作　　者：戴广乾[1] 边方胜[1] 徐榕青 曾策[1] 陈全寿[1] DAI Guang-qian;BIAN Fang-sheng;XU Rong-qing;ZENG Ce;CHEN Quan-shou(The 29th Research Institute of CETC,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所

出　　处：《电镀与涂饰》2019年第23期1262-1265,共4页Electroplating & Finishing

摘　　要：对比了分别采用平行单挂和双排背对背的装挂方式电镀金时,微波印制电路板背面和正面的金盐消耗与金层厚度。结果表明,电路板背面和正面的金层厚度比(T)与电路板背面和正面的金层面积比(Sr)成反比,电路板背面和正面的金盐消耗比(V)与S_r成正比。双排平行挂具夹点距离为1.5 cm的装挂条件下,相同Sr对应的T和V都小于夹点距离为3.0 cm时的情况。The consumption of gold salt as well as the thickness and area of gold coatings obtained on the back and front sides of microwave printed circuit board in a gold electroplating process were compared under the conditions of single-row racking and back-to-back double-row racking.The results showed that the gold coating thickness ratio(marked as T) and gold-coated area ratio(marked as S_r) between the back side and front side of a printed circuit were inversely proportional,while the gold salt consumption ratio(marked as V) between the back side and front side were directly proportional to S_r.Both T and V for double-row racking with the same Sr when the grip distance of the two rows(marked as D) was 1.5 cm were lower than that when D was 3.0 cm.

关 键 词：微波印制电路板 电镀金 装挂 厚度 面积 金盐消耗 

分 类 号：TQ153.18[化学工程—电化学工业]