化学镀铜自催化反应及镀层延展性研究  

Study on Autocatalytic Reaction of Electroless Cu Plating and the Ductility of Cu Deposits

作　　者：李晓红 Li Xiaohong(Doctoral Workstation,Lingnan Normal University,Zhanjiang 524048,China)

机构地区：[1]岭南师范学院博士工作站

出　　处：《广东化工》2020年第2期24-25,共2页Guangdong Chemical Industry

摘　　要：研究了6种化学镀铜液的镀铜反应过程,详尽分析了反应开始后2~30 min期间的沉积速率,总结出了影响化学镀铜自催化反应过程的两个主要因素。一是化学镀铜液中微量镍的存在可加强自催化反应;二是镀液中的稳定剂会减缓自催化反应。文章还测试了4种化学镀铜液制得的镀层的断裂伸长率,发现镍离子及较慢的自催化反应速度有利于镀层延展性的提高。The reaction processes of six electroless Cu baths were studied.The deposition rates in the duration of 2~30 min were analyzed in detail.Two main factors were summarized affecting the autocatalytic reaction of electroless Cu plating.Firstly,the presence of trace nickel in electroless Cu bath enhances the autocatalytic reaction.Secondly,the stabilizers in the bath slow down the autocatalytic reaction.The elongations of four kinds of Cu deposits made from different electroless Cu baths were measured.It was found that Ni2+and slower autocatalytic reaction rate have positive effects on the ductility of Cu deposits.

关 键 词：化学镀铜 自催化反应 沉积速率 延展性 

分 类 号：TQ[化学工程]