2.5D封装有机基板制造工艺研究  

Study on manufacturing process of the 2.5D packaging organic substrate

作　　者：刘晓阳 陈文录 

出　　处：《印制电路信息》2020年第1期1-9,共9页Printed Circuit Information

摘　　要：文章以一款实用高性能CPU的2.5D封装有机基板为研究对象,对有机基板制备的工艺流程、关键技术难点进行了详细实验和讨论,最终完成了合格样板的制作,并形成小批量产晶的生产能力。Based on the 2.5D packaging organic substrate of a practical high performance CPU,the technological process and the key technical difificulties of organic substrates preparation have been tested and discussed in this paper.Finally the production of qualified samples has been completed,and a small-lot production capacity has been formed.

关 键 词：2.5D封装 有机基板 制造工艺 

分 类 号：TN41[电子电信—微电子学与固体电子学]