Sn42Bi57Ag1无铅焊膏用活性剂的优化设计  

Optimization of activators for Sn42Bi57Ag1 lead-free solder paste

作　　者：王君 赵麦群[1] 李鹏宇 袁昕 WANG Jun;ZHAO Maiqun;LI Pengyu;YUAN Xin(School of Materials Science and Engineering,Xi'an University of Technology,Xi'an 710048,China)

机构地区：[1]西安理工大学材料科学与工程学院

出　　处：《电子元件与材料》2020年第2期89-94,共6页Electronic Components And Materials

基　　金：陕西省教育厅重点实验室科研计划项目(14JS069)

摘　　要：针对Sn42Bi57Ag1无铅焊料开发出一种低温无铅焊锡膏,着重研究助焊剂中活性剂对焊锡膏润湿性能的影响。以铺展性能作为主要评价指标,通过回流焊接实验,对用于助焊剂的7种有机酸进行了筛选。最终选取了性能较好的甲基丁二酸、己二酸、水杨酸与丁二酸四种有机酸进行正交试验,通过量化分析选取正交试验水平,根据方差分析确定助焊剂中活性剂的最佳组合。结果表明:有机酸的复配能显著改善焊点铺展情况,当甲基丁二酸、己二酸、水杨酸与丁二酸质量比为2∶3∶5∶2时,Sn42Bi57Ag1无铅焊膏的润湿性能优异,焊点铺展率达86.52%。A new low temperature lead-free solder paste was developed for Sn42Bi57Ag1 lead-free solder.Here was mainly studied the effect of activators on the wettability of solder paste.By mainly evaluating spreading rate,seven organic acids were screened by reflow soldering experiment.Among them,four organic acids(methyl succinic acid,adipic acid,salicylic acid and succinic acid)with better results were finally selected for orthogonal test.The orthogonal test level was determined by quantitative analysis.The optimal composition of activators in flux was obtained by variance analysis.The results show that the composite organic acids can significantly improve the solder joint spreading rate.When the mass ratio of methyl succinic acid,adipic acid,salicylic acid and succinic acid is 2∶3∶5∶2,the wettability of Sn42Bi57Ag1 lead-free solder paste is optimized with spreading rate of 86.52%.

关 键 词：无铅焊膏 活性剂 铺展率 正交试验 回流焊接 焊点形貌 

分 类 号：TN304[电子电信—物理电子学]