一种基于低温共烧陶的无引线键合封装  

Wireless Bonding Package Based on Low Temperature Co-fired Ceramics

作　　者：焦静静 石云波[1] 赵永祺 赵思晗 张婕 米振国 康强 JIAO Jingjing;SHI Yunbo;ZHAO Yongqi;ZHAO Sihan;ZHANG Jie;MI Zhenguo;KANG Qiang(Science and Technology on Electronic Test&Measurement Laboratory,North University of China,Taiyuan 030051,China;Norinco Group Test and Measuring Academy Test and Measurement Academy,Huayin 714200,China)

机构地区：[1]中北大学电子测试技术重点实验室,山西太原030051 [2]中国兵器工业实验测试研究院,陕西华阴714200

出　　处：《压电与声光》2020年第1期47-50,共4页Piezoelectrics & Acoustooptics

基　　金：国家自然科学基金国家重大科研仪器研制基金资助项目(51727808);电子测试技术重点实验室稳定支持基金资助项目(WD61420010411804)

摘　　要：为提高微机电系统(MEMS)加速度计的可靠性,减小因为引线键合断裂造成的传感器失效,该文设计了一种基于低温共烧陶瓷的无引线键合封装。该封装采用阳极键合技术将低温共烧陶瓷基板与芯片连接,同时将电路转接板同步集成。结果表明,该封装结构可减小传感器的封装尺寸,有效提高了MEMS加速度计的可靠性。To improve the reliability of MEMS accelerometers,reduce sensor failures caused by wire bonding breakage,a wireless bonding package based on low temperature co-fired ceramics(LTCC)is designed in this paper.The package uses an anodic bonding technique to connect the LTCC substrate to the chip,and simultaneously integrates the circuit transfer board synchronously.This package structure can reduce the package size of the sensor and effectively improve the reliability of the MEMS accelerometers.

关 键 词：微机电系统(MEMS) 低温共烧陶瓷(LTCC) 加速度计 封装 无引线键合 

分 类 号：TN384[电子电信—物理电子学] TM22[一般工业技术—材料科学与工程]