添加钯和铜元素改善金包银复合键合丝的力学性能  

Enhancement of Mechanical Properties of Gold-Coated Silver Composite Bonding Wire with Palladium and Copper Elements Addition

作　　者：康菲菲 孔建稳 陈家林[2] 周文艳[2] 杨国祥 裴洪营 Kang Feifei;Kong Jianwen;Chen Jialin;Zhou Wenyan;Yang Guoxiang;Pei Hongying(State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co.,Ltd.Kunming 650106,China;Kumming Institute of Precious Metals,Kunming 650106,China)

机构地区：[1]贵研铂业股份有限公司稀贵金属综合利用新技术国家重点实验室,云南昆明650106 [2]昆明贵金属研究所,云南昆明650106

出　　处：《稀有金属》2019年第12期1302-1308,共7页Chinese Journal of Rare Metals

基　　金：云南省重点研发计划项目(2017IB016);第62批中国博士后科学基金面上项目(2017M623316XB)资助

摘　　要：用固相复合技术制备微电子封装用金包银复合键合丝,利用金相显微镜、高低温拉力仪、推拉力计和扫描电镜(SEM),对不同合金成分的金包银复合键合丝的定向凝固组织及力学性能进行表征,获取晶粒尺寸大小及形貌特征,分析钯、铜元素对再结晶温度、力学性能参数及键合强度的影响,阐明钯和铜对金包银复合键合丝的强化机制。结果表明:在金包银复合键合丝芯材中添加铜,组织呈等轴晶,而同时添加钯和铜,铸态组织由胞状树枝晶和胞状晶组成,晶粒细小均匀。钯和铜可以提高复合键合丝的再结晶温度使其具备更高的耐热性。同时添加钯和铜的复合键合丝具有较高的塑/韧性,键合后弧形稳定,拉力及焊球推力最高,键合质量好。钯、铜微合金化金包银复合键合丝的强化机制为:固溶强化和细晶强化。二元复合添加的复合键合丝具有更高的强化增量,其力学性能更为优异。Gold-coated silver composite bonding wire was prepared by solid phase composite technique for microelectronic package. The directional solidification structure and mechanical properties of gold-coated silver composite bonding wires with different alloy compositions were characterized by metallographic microscopy, high-low temperature tensile tester, push-pull gauge and scanning electron microscopy(SEM). The grain size and morphology characteristics were obtained. The effects of palladium and copper on recrystallization temperature, mechanical properties and bonding strength were analyzed, and the strengthening mechanism of palladium and copper on gold-coated silver composite wires was clarified. The results showed that copper was added to the gold-coated silver composite bonding wire core, and the microstructure was equiaxial crystal, while palladium and copper were added at the same time, the as-cast microstructure consisted of cellular dendrite and cellular crystal, and grains were uniformly fine. Palladium and copper could increase the recrystallization temperature of gold-coated silver composite wire to make them more heat resistance. The composite bonding wire with both palladium and copper had high plasticity/toughness, stable arc shape after bonding, the highest wire pulling force and ball shear force, and good bonding quality. The strengthening mechanism of palladium and copper micro-alloying gold-coated silver composite bonding wire was as follows: solid solution strengthening and fine grain strengthening. The composite bonding wires added by binary composites had higher strengthening increment, and their mechanical properties were better.

关 键 词：金包银复合键合丝 微合金化 铸态组织 力学性能 键合强度 

分 类 号：TK91[动力工程及工程热物理]