焊点金属间化合物生长的相场法模拟  

Phase field simulation of intermetallic compounds growth in solder joint

作　　者：赵志鹏 张晓敏[1,2] 谭树林 邬周志 张恒嘉 ZHAO Zhipeng;ZHANG Xiaomin;TAN Shulin;WU Zhouzhi;ZHANG Hengjia(College of Aerospace Engineering,Chongqing University,Chongqing 400044,China;Chongqing Key Laboratory of Heterogeneous Material Mechanics,Chongqing University,Chongqing 400044,China)

机构地区：[1]重庆大学航空航天学院,重庆400044 [2]重庆大学非均质材料力学重庆市重点实验室,重庆400044

出　　处：《电子元件与材料》2020年第3期52-58,共7页Electronic Components And Materials

基　　金：国家自然科学基金面上项目(11872130);重庆市自然科学基金面上项目(cstc2019jcyj-msxmX0084)。

摘　　要：采用相场法并结合热-力-电-扩散强耦合理论,研究了铜/锡/铜焊点金属间化合物(Intermetallic Compounds,IMCs)的生长规律。其中,铜和锡交互扩散的行为是通过引入铜和锡在不同浓度(摩尔分数)下的扩散系数和有效电荷数来表征。模拟结果表明强耦合状态下的IMCs生长模拟值与实验值吻合较好,并且电流密度越大,IMCs生长越快。此外,对不同耦合状态下IMCs生长的各热力学驱动力的变化研究表明焊点在多物理场作用下,温度梯度导致的热迁移对IMCs生长的影响较小,而应变梯度导致的应力迁移对IMCs生长的影响较大,并且起促进作用。The growth of intermetallic compounds(IMCs)in Cu/Sn/Cu solder joints was investigated using phase field method and strongly coupled thermo-mechano-electro-diffusional theory.The interdiffusion between the Cu and Sn was characterized by the diffusion coefficients and effective charge number at different mole concentration of Cu and Sn.The results show that the IMCs growth using strongly coupled theory are consistent with experimental results at a various current densities,and faster growth of IMCs is achieved at larger current density.In addition,the variation of thermodynamic driving forces during the growth at different coupled states indicate that the temperature gradient induced thermal migration has little effect on the growth of IMCs.Nevertheless,the strain gradient induced migration can accelerate the growth of IMCs.

关 键 词：焊点 金属间化合物 热-力-电-扩散强耦合 电迁移 相场法 驱动力 

分 类 号：TG425[金属学及工艺—焊接]