基于复合基板微波电路设计的小型化TR组件  

Miniaturized TR Module Based on Microwave Circuit Design of Composite Substrate

作　　者：张帅 杨志保 吴天阳 张晖 ZHANG Shuai;YANG Zhibao;WU Tianyang;ZHANG Hui(China Key System&Integrated Circuit Co.,Ltd.,Wuxi 214072,China)

机构地区：[1]中科芯集成电路有限公司,江苏无锡214072

出　　处：《电子与封装》2020年第3期12-14,共3页Electronics & Packaging

摘　　要：以HFSS软件对采用复合基板设计的C波段TR组件微波电路进行设计及仿真试验,结果显示其具备优良的电特性。制作完成后的产品体积较同行业内产品缩小了30.6%,此设计实现了组件小型化,为工程应用提供了理论支撑,提高了TR组件在收发系统中的使用效率。The HFSS software is used to simulate the microwave circuit of C-band TR module with composite substrate,and the results show that it has excellent electrical characteristics.The volume of the finished product is 30.6%smaller than that of the products in the same industry,realizes the miniaturization of the components,provides the theoretical supports for the engineering application,and improves the use efficiency of TR components in the transceiver system.

关 键 词：HFSS软件 复合基板 TR组件 小型化 

分 类 号：TN492[电子电信—微电子学与固体电子学]