陶瓷与金属连接的研究及应用进展  

Progress in Research and Application of Joining of Ceramics and Metals

作　　者：范彬彬 赵林 谢志鹏 FAN Binbin;ZHAO Lin;XIE Zhipeng(School of Material Science and Engineering,Jingdezhen Ceramic Institute,Jingdezhen 333403,Jiangxi,China;State Key Lab of New Ceramics and Fine Processing,School of Materials Science and Engineering,Tsinghua University,Beijing 100084,China)

机构地区：[1]景德镇陶瓷大学材料科学与工程学院,江西景德镇333403 [2]清华大学材料学院新型陶瓷与精细工艺国家重点实验室,北京100084

出　　处：《陶瓷学报》2020年第1期9-21,共13页Journal of Ceramics

基　　金：国家自然科学基金(51672147)。

摘　　要：陶瓷与金属的连接件在新能源汽车、电子电气、半导体封装和IGBT模块等领域有着广泛的应用,因此,具有高强度、高气密性的陶瓷与金属的封接工艺至关重要。目前,国内外在该领域内对于烧结金属粉末法(陶瓷金属化)、活性金属钎焊法和陶瓷基板覆铜等连接工艺已经有了深入研究和许多进展。本文对近二十年国内外广泛用于陶瓷与金属连接的产业化工艺技术及其应用进行阐述,并对其发展方向进行展望。Joining of ceramic and metal parts is widely used in new energy vehicles,electronic power devices,semiconductor packaging and IGBT modules.Therefore,it is crucial to realize ceramic-metal sealing processes with high strength and high air tightness.Currently,there have been in-depth studies and significant progress has been achieved in this area.Va rious methods,such as metal powder sintering(ceramic metallization),active metal brazing and copper-coated ceramic substrate,have been reported in open literature.This paper is aimed to review the technologies for industrialization of this field and t he applications widely for the joining of ceramics and metals in the last 20 years,while the future development of the related technologies will be discussed.

关 键 词：陶瓷与金属连接 封接工艺 陶瓷金属化 陶瓷基板覆铜 

分 类 号：TQ174.75[化学工程—陶瓷工业]