一种高频高速挠性覆铜板的研制  

Development of a high frequency and high speed flexible copper clad laminate

作　　者：付志强 昝旭光[1] 伍宏奎[1] 茹敬宏[1] Fu Zhiqiang;Zan Xuguang;Wu Hongkui;Ru Jinghong(Nanjing Research Institute of Electronics Technology,Nanjing 210039,China)

机构地区：[1]广东生益科技股份有限公司,广东东莞523808

出　　处：《印制电路信息》2020年第3期16-20,共5页Printed Circuit Information

摘　　要：使用两种不同T_g的聚酰亚胺树脂,一种相对较高T_g(HT_g)的聚酰亚胺靠近铜箔在外侧,主要起支撑作用;另一种相对较低T_g(LT_g)的聚酰亚胺远离铜箔在内测,主要起低温粘结和主要提供介电性能作用。由此方法可以制备目前行业内需求较多的75μm、100μm等厚度的高频高速挠性覆铜板,其介电性能在10 GHz下,D_k/D_f分别是2.9/0.0033,可以运用于目前的5G通讯领域。This paper uses two polyimide resins with different Tg with a relatively high Tg(HTg)polyimide near the copper foil on the outside,which is mainly for supporting and a relatively low Tg(LTg)polyimide which is measured from the copper foil,and is mainly for low temperature bonding and primarily to provide dielectric properties.This method can prepare high-frequency high-speed flexible copper clad laminates with 75μm and 100μm thicknesses,which are currently in high demand in the industry.The dielectric properties are 10 GHz,Dk/Df is 2.9/0.0033 respectively,which can be applied to the current 5G communication field.

关 键 词：聚酰亚胺 介电性能 高频高速 挠性覆铜板 

分 类 号：TN41[电子电信—微电子学与固体电子学]