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作 者:左陈 李刚林 吴磊 茹敬宏[1] 伍宏奎[1] Zuo Chen;Li Ganglin;Wu Lei;Ru Jinghong;Wu Hongkui(National Engineering Research Center of Electronic Circuits Base Materials,Shengyi Technology Co.,Ltd.,Dongguan 523808,China)
机构地区:[1]广东生益科技股份有限公司国家电子电路基材工程技术研究中心,广东东莞523808
出 处:《印制电路信息》2020年第3期21-25,共5页Printed Circuit Information
摘 要:合成一种聚丙烯酸酯树脂,并配制成耐高温丙烯酸酯压敏胶。优选低收缩PET膜,在其表面涂覆一层厚度为5μm的耐高温丙烯酸酯压敏胶,干燥后覆合离型膜,熟化后得到承载膜,将该承载膜应用于超薄覆盖膜及挠性覆铜板。结果表明,所制备的承载膜贴合覆盖膜及挠性覆铜板的经纬向尺寸收缩分别小于800×10^(-6)和400×10^(-6)。当固化剂用量为2.5份时,A态及高温压合后的剥离强度分别为12g/25 mm和25 g/25 mm,且具有优异的耐化学性和抗污染性,满足FPCB的加工应用要求。A polyacrylate resin was synthesized and used to prepare a high temperature resistant polyacrylate pressure sensitive adhesive.The polyacrylate pressure sensitive adhesive was coated on a low shrinkage PET film and covered with release film and then cured to prepare a high temperature resistant carrier film.The carrier film with high temperature resistance was applied to ultrathin coverlay and FCCL.The results showed that the machine direction and transverse direction size shrinkage of the high temperature resistant carrier film covering with coverlay and FCCL is less than 800ppm and 400ppm,respectively.The accepted state and high temperature peel strength of the high temperature resistant carrier film were 12g/25mm and 25g/25mm,respectively.The high temperature resistant carrier film has excellent chemical resistance and pollution resistance,which can satisfy the FPC process request.
分 类 号:TN41[电子电信—微电子学与固体电子学]
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