基于LCP柔性衬底的MEMS V型梁结构的设计制备与表征  

Design,Fabrication and Characterization of MEMS V-Beam Structure Based on LCP Flexible Substrate

作　　者：吝晓楠 吴虹剑 田蕾 于洋 韩磊[2] LIN Xiaonan;WU Hongjian;TIAN Lei;YU Yang;HAN Lei(Electronic Science and Engineering Department,Southeast University,Nanjing 211189,China;Key laboratory of MEMS of the Ministry of Education,Southeast University,Nanjing 210096,China)

机构地区：[1]东南大学电子科学与工程学院,南京211189 [2]东南大学MEMS教育部重点实验室,南京210096

出　　处：《电子器件》2020年第1期10-14,共5页Chinese Journal of Electron Devices

基　　金：国家级大学生创新创业训练计划项目(201810286034);国家自然科学基金项目(61774032)。

摘　　要：为探索在复杂环境应用中柔性衬底弯曲对V型梁结构力学特性的影响,提出了一种基于LCP柔性衬底弯曲条件下MEMS V型梁结构的力学分析方法,对柔性MEMS V型梁器件的弯曲特性从软件仿真和实验验证两个方面进行深入的研究。揭示了MEMS V型梁衬底发生弯曲后,对器件驱动性能的影响。实验结果表明,当柔性衬底弯曲曲率从0增大到33.3 m^-1,V型梁热驱动器的驱动电流逐渐增大,测量值与仿真值的误差小于6.0%,与理论模型相符。In order to explore the influence of flexible substrate bending on the mechanical properties of V-beam structure in complex environment,a mechanical analysis method of MEMS V-beam structure based on LCP flexible substrates is proposed.Bending characteristic of flexible MEMS V-beam devices is studied by considering the aspects of software simulation and experimental verification.The influence of bending flexible substrate on the actuation capability of the device is revealed.The experimental results show that when the bending curvature of the flexible substrate increases from 0 to 33.3 m^-1,the actuation current of the V-beam thermal actuator increases,and the error between the measured and simulated results is less than 6.0%,which is consistent with the theoretical model.

关 键 词：MEMS 弯曲特性 柔性衬底弯曲 V型梁结构 力学特性 

分 类 号：TP211.4[自动化与计算机技术—检测技术与自动化装置] TP212[自动化与计算机技术—控制科学与工程]