氧化锆陶瓷Cu/Ni/Au镀层的制备及性能  

Preparation and Properties of Zirconia Cu/Ni/Au Plating

作　　者：任鹏 Ren Peng

机构地区：[1]比亚迪精密制造有限公司,广东深圳518116

出　　处：《化工设计通讯》2020年第4期93-94,共2页Chemical Engineering Design Communications

摘　　要：采用PVD与化学镀相结合的方法,对氧化锆陶瓷进行金属化处理,制备出性能优异的铜镍金镀层。工艺条件:化学铜镀pH12.5,温度50℃,施镀时间10min;化学镍镀pH5.0,温度75℃,施镀时间15min;化学镀金PH6.5,温度88℃,施镀时间60min。在上述工艺条件下,得到铜、镍、金镀层的厚度平均值分别为2.607μm、1.709、0.525,均在要求范围内。镀层拉拔力测试、水煮测试、中性盐雾测试、沾锡测试均合格,表明镀层具有良好的结合力、耐蚀性与可焊性。Using PVD and electroless plating method to metallize the zirconia ceramic to prepare a Cu/Ni/Au coating with excellent performance.The process parameters:copper plating PH 12.5,temperature 50℃,plating time 10min;nickel plating PH 5.0,temperature 75℃,plating time 15min;gold plating PH 6.5,temperature 88℃,plating time 60min.Under the above mentioned process,the thickness of Cu,Ni,Au is 2.607,1.709,0.525,respectively,and is in the standard range.The pull test,boiled water test,salt spray test and tin wettability test indicate that the Cu/Ni/Au plating has good adhesion,corrosion resistance and solderability.

关 键 词：化学镀 陶瓷 金属化 铜镍金 

分 类 号：TQ174.6[化学工程—陶瓷工业]