灌封工艺方案与产品结构设计的匹配性研究  

Study on the Matching Between Potting Process and Product Structure Design

作　　者：张世莉[1] 肖玲[1] 陈亮[1] 周元[1] ZHANG ShiLi;XIAO Ling;CHEN Liang;ZHOU Yuan(The 24th Research Institute of China Electronics Technology Group Corporation,Chongqing400060,P.R.China)

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《微电子学》2020年第2期297-302,共6页Microelectronics

基　　金：模拟集成电路国家重点实验室基金资助项目(614280204030317)。

摘　　要：在高可靠微电路模块设计中,封装结构通常采用产品灌封的方式,以满足产品抗冲击振动、恶劣环境、导热、绝缘等要求。剖析了某灌封模块样品的应力失效典型案例。采用仿真与试验验证相结合的方式进行验证,提出了灌封工艺方案与产品结构设计匹配性与适宜性的研究方法。该方法为后续灌封方案与产品结构匹配性提供了理论指导和技术支持。In the design of highly reliable microcircuit module, the potting process was adopted usually in the packaging structure to meet the requirements of product in mechanical shocking and vibrating, harsh environment, heat exchanging, insulation, etc. A typical stress failure case of certain potting module was analyzed. A method was proposed to investigate the matching and suitability between the potting process and product structure design, and it was verified by simulation and test. This method provided a theoretical guidance and technical support for the subsequent study on the matching between the potting process and the product structure.

关 键 词：灌封工艺 结构设计 环境适应性 

分 类 号：TN406[电子电信—微电子学与固体电子学]