大功率倒装LED固晶工艺研究  

Research on Die Bonding Packaging Technology of High Power Flip-chip LED

作　　者：杨宁 王冠玉 黄培文 谢健兴 YANG Ning;WANG Guanyu;HUANG Peiwen;XIE Jianxing(Foshan NationStar Optoelectronics Co.,Ltd.,Foshan 528000,China;South China University of Technology,School of Mechanical and Automotive Engineering,Guangzhou 510641,China)

机构地区：[1]佛山市国星光电股份有限公司,广东佛山528000 [2]华南理工大学机械与汽车工程学院,广东广州510641

出　　处：《中国照明电器》2020年第3期12-17,共6页China Light & Lighting

基　　金：佛山市核心技术攻关项目"车用高流明复合反射型LED芯片及高密度矩阵式封装的关键技术研发与应用"(1920001000724)。

摘　　要：随着LED应用的深入和普及,对其性能表现要求的提高,大功率倒装LED器件将成为必然的发展趋势。其中,倒装固晶封装工艺技术是影响其性能表现和可靠性的决定性因素之一。首先,通过对比不同的点浆头形状、点浆头尺寸以及浆量,分析点浆上锡工艺对固晶性能的影响;其次,通过对比分析不同开孔数量钢网及不同的锡膏粒径,探究固晶层的机械性能表现;另外,通过有无助焊剂的对比分析实验,阐述其对器件光电参数的影响;最后,研究了温度在固晶工艺中的作用,总结了不同炉温对固晶性能表现的影响。本文的研究对大功率倒装LED的应用推广具有重要的现实意义。With the deepening and popularization of LED applications and the increase in performance requirements,high power flip-chip LED will become an inevitable development trend.However,die-bonding technology is one of the decisive factors affecting its performance and reliability.First of all,the effect of solder paste dispensing on the die-bonding properties was analyzed by comparing the shapes of different nozzles,the size of the nozzles,and the amount of paste.Secondly,the mechanical properties of the solidified layer were explored by comparing and analyzing the stencils with different opening numbers and different solder paste particle sizes.In addition,through the comparative analysis experiment of the presence or absence of flux,its influence on the photoelectric parameters were explained;Finally,the role of temperature in the curing process was studied,and the effect of different furnace temperatures on the performance of die bonding was summarized.These researches in this article have important practical significance for the application and promotion of high power flip-chip LED.

关 键 词：大功率LED 倒装 固晶 空洞率 推拉力 光通量 

分 类 号：TH162[机械工程—机械制造及自动化]