两种热电分离式MCPCB导热性能的对比研究  

Comparative Study on Heat Dissipation Performances of Two Types of Metal Core Printed Circuit Board Featuring Electrically-Neutral-Thermal-Path

作　　者：秦典成 赵永新 陈爱兵 QIN Diancheng;ZHAO Yongxin;CHEN Aibing(Guangdong LED Packaing Heat Sink Substratae Engineering Technology Research Center,Zhuhai Guangdong 519180,China;Rayben Technologies(Zhuhai)Ltd.Co.,Zhuhai Guangdong 519180,China)

机构地区：[1]广东省LED封装散热基板工程技术研究中心,广东珠海519180 [2]乐健科技(珠海)有限公司,广东珠海519180

出　　处：《电子器件》2020年第2期402-407,共6页Chinese Journal of Electron Devices

基　　金：广东省LED封装散热基板工程技术研究中心协同创新与平台环境建设专项项目(509141674069)。

摘　　要：利用SMT工艺将两种功率不同的LED分别与设计完全相同的热电分离式铜基板及铝基板组装成模组,然后借助结温测试系统及积分球系统对两种金属基板的散热性能进行了对比研究。结果表明,热电分离式铜基板较之热电分离式铝基板仅具备微弱的散热优势,这种优势随着LED的功率增加有所扩大。当LED功率为9 W时,铜基板及铝基板所对应的LED模组热阻分别是3.16℃/W、3.26℃/W;当LED功率为15 W时,铜基板及铝基板所对应的LED模组热阻分别是2.33℃/W、2.46℃/W。Two types of LEDs with different powers were respectively mounted on electrically-neutral-thermal-path MCPCB,namely copper based and aluminum based MCPCB to prepare LED modules employing SMT technology. Subsequently,a comparison of heat dissipation performances between the aforementioned MCPCBs based on thermal resistances of LED modules was conducted via junction tester system integrating sphere system. It was found that the copper based MCPCB merely presented weak heat dissipation edge in comparison with aluminum based counterpart,and this edge was widened as the power of LED increased. When LED is 9 W,the thermal resistances of LED modules corresponding to copper based MCPCB and aluminum based MCPCB were 3.16 ℃/W and 3.26 ℃/W respectively. When LED is 15 W,the thermal resistances of LED modules corresponding to copper based MCPCB and aluminum based MCPCB were 2.33 ℃/W and 2.46 ℃/W respectively.

关 键 词：LED 散热性能 热阻 热电分离 铜基板 铝基板 

分 类 号：TN04[电子电信—物理电子学]