军用倒装焊器件底部填充胶选型及验证方法讨论  

Discussion on Type Selection and Verification Method of Underfill Adhesive for Military Flip Chip Solder Devices

作　　者：冯春苗 张欲欣 付博彬 FENG Chunmiao;ZHANG Yuxin;FU Bobin(Aerospace Science and Technology Group 9th Research Institute No.771 Institute,Xi′an 710100,China)

机构地区：[1]航天科技集团第九研究院第七七一研究所,西安710100

出　　处：《电子与封装》2020年第5期7-10,共4页Electronics & Packaging

摘　　要：从分析倒装焊器件底部填充的必要性入手,对底部填充胶的选型流程、选型基本方法及重点参数匹配情况进行了分析,优选出4款底部填充材料。通过对4款材料关键参数的理论计算及恒定加速度、热力学耦合仿真计算,优选出一种材料作为样本材料。同时对底部填充材料验证内容进行了梳理,通过试验验证摸索出材料的适用范围及边界条件。该底部填充胶的选型验证方法对于军用混合集成电路其他聚合材料的选型具有一定的指导意义。This article starting from the analysis ofthe necessity of underfilling flip-chip devices,the selection process,basic selection methods and key parameters matching of underfilling adhesive were analyzed,and four underfilling materials were selected.Through theoretical calculation of key parameters of four materials and simulation calculation of constant acceleration and thermodynamic coupling,one material is selected as the sample material.At the same time,the verification contents of underfill materials are combed,and the applicable scope and boundary conditions of the materials are explored through test certificates.The verification method for the selection of underfill adhesive has certain guiding significance for the selection of other polymeric materials for military hybrid integrated circuits.

关 键 词：底部填充胶 选型 仿真 理论分析 

分 类 号：TN305.94[电子电信—物理电子学]