自动真空探针台技术研究  

Study on Technology of Automatic Vacuum Probe

作　　者：吕磊[1] LV Lei(The 45th Research Institute of CETC,Beijing 100176,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2020年第3期66-70,共5页Equipment for Electronic Products Manufacturing

摘　　要：从MEMS器件晶圆级测试过程中所需的特殊测试环境出发,简述了自动真空探针台的操作流程,介绍了设备的主要技术特点,并对该设备机械结构的特殊需求及后续开发方案进行了详细描述。According to the special testing environment needed in wafer level testing of MEMS devices,the operation process of automatic vacuum probe is briefly described,and the main technical features of the equipment are introduced.The special requirements of the mechanical structure of the equipment and the follow up development plan are described in detail.

关 键 词：真空探针 真空腔体 承片台 探卡 

分 类 号：TN307[电子电信—物理电子学]