低温对ECAP纯铜性能与组织的影响  

Effect of low temperature on properties and microstructure of ECAP copper

作　　者：薛海平 刘平[1] 刘新宽[1] 陈小红[1] 李伟[1] 马凤仓[1] 周洪雷 张柯[1] XUE Haiping;LIU Ping;LIU Xinkuan;CHEN Xiaohong;LI Wei;MA Fengcang;ZHOU Honglei;ZHANG Ke(School of Materials Science and Engineering, University of Shanghai for Science and Technology,Shanghai 200093, China)

机构地区：[1]上海理工大学材料科学与工程学院,上海200093

出　　处：《功能材料》2020年第6期6190-6194,6220,共6页Journal of Functional Materials

基　　金：国家自然科学基金资助项目(51771119)。

摘　　要：研究了温度对铜ECAP组织和性能的影响,对比了低温和室温变形后的组织异同。结果表明:相对于室温ECAP,低温样品的硬度略微提高。通过对比金相组织发现,在低道次时,低温条件明显阻碍了晶粒变形,高道次时抑制了室温高道次常出现的动态再结晶现象。ECAP处理后进行退火,发现室温样品在140℃时硬度出现明显降低,而低温ECAP样品则出现反常,仍保持高的硬度。In this paper,the effect of temperature on the microstructure and properties of copper ECAP was studied,and the similarities and differences between the low temperature and room temperature deformation were compared.The results showed that the hardness of the low-temperature samples was slightly increased compared to that of the room temperature ECAP samples.By comparing the metallographic structure,it was found that the low temperature condition obviously hindered the grain deformation at low passes,and inhibited the dynamic recrystallization phenomenon which often occurred at room temperature and high passes.Annealing was performed after ECAP treatment,and it was found that the hardness of room-temperature ECAP samples decreased significantly at 140℃,while the low-temperature ECAP samples appeared abnormal and still maintained high hardness.

关 键 词：等通道转角挤压 工业纯铜 组织与性能 低温 

分 类 号：TG146.11[一般工业技术—材料科学与工程]