iRoot SP直接充填后与牙本质壁粘结强度的临床初探  

Effect of obturation techniques on the push-out bond strength of iRoot SP

作　　者：张福裕 仇晓慧 章非敏[3] 张光东[4] 徐海[1] ZHANG Fuyu;QIU Xiaohui;ZHANG Feimin;ZHANG Guangdong;XU Hai(Department of Conservative Dentistry and Endodontics,Jiangsu Key Laboratory of Oral Diseases,Nanjing Medical University,Affiliated Hospital of Stomatology,Nanjing Medical University,Nanjing 210029,China)

机构地区：[1]南京医科大学口腔疾病研究江苏省重点实验室,南京医科大学附属口腔医院牙体牙髓科,江苏南京210029 [2]常州市金坛区金城镇卫生院口腔科,江苏常州213000 [3]南京医科大学口腔疾病研究江苏省重点实验室,南京医科大学附属口腔医院口腔修复科,江苏南京210029 [4]南京医科大学口腔疾病研究江苏省重点实验室,南京医科大学附属口腔医院口腔综合科,江苏南京210029

出　　处：《口腔医学》2020年第5期437-442,共6页Stomatology

基　　金：江苏高校优势学科建设工程(2018-87)。

摘　　要：目的比较iRoot SP直接充填和联合牙胶尖充填根管后与根管壁的粘结强度。方法上颌前牙40颗截去牙冠并修整牙根长度为12 mm,ProTaper预备至F3,将处理好的样本随机分成4组(n=10),用牙胶尖和/或iRoot SP分别用冷侧压法、热牙胶法、单尖法、纯糊剂法充填。1周后,所有样本切成厚度为1.00 mm薄片,选取第2、5、8分别代表根尖1/3、根中1/3、根冠1/3段在万能试验机上计算推出强度,并用SPSS 22.0做统计学分析,同时观察断裂方式。结果在根尖1/3段,纯糊剂技术组的粘接强度最低(P<0.05);在根冠1/3段,热牙胶技术组粘接强度最低(P<0.05)。纯糊剂技术组各段粘接强度无明显差异(P>0.05)。热牙胶技术组以界面断裂为主,其他三组则是混合断裂和内聚断裂为主。结论充填技术影响iRoot SP与根管壁的粘接强度;iRoot SP直接充填后具有可接受的粘结强度。Objective To evaluate the bond strength of iRoot SP with and without gutta-percha by different root canal obturation techniques. Methods Forty single-canal upper incisors were collected and decorated to obtain 12 mm root segments. The root canals were prepared by using ProTaper rotary files and allocated into 4 groups randomly(n=10), then obturated with gutta-percha and(or) iRoot SP by cold lateral compaction, continuous wave condensation, single core, sealer-only backfill techniques respectively. All samples were sliced perpendicularly to the long axis from the apical to the coronal side on a low-speed microtome to a thickness of 1.00 mm. The bond strengths of the 2 nd, 5 th, 8 th piece,which were on behalf of the apical 1/3 segment, the middle 1/3 segment and the coronal 1/3 segment respectively, were calculated by a universal testing machine and the fracture mode was observed at the same time. The data were analyzed using SPSS 22.0 software package. Results In the one-third apical segment, the SOB technology had the lowest bond strength(P<0.05);while in the one-third coronal segment, CWC technology showed the lowest bond strength(P<0.05). There were no significant differences among three segments in SOB technology group. The mainly fracture mode was interfacial fracture in CWC group while cohesive fracture and mixed fracture in other three groups. Conclusion Filling techniques affect the bond strength of the iRoot SP to the root canal wall. iRoot SP has an acceptable bond strength when sealer only backfill technique is used.

关 键 词：iRoot SP 粘结强度 充填技术 

分 类 号：R781.05[医药卫生—口腔医学]