高散热基板(铝基+FR-4芯板)制作方法  

Manufacturing of high heat dissipation PCB

作　　者：蓝春华 张鸿伟 沙伟强 Lan Chunhua;Zhang Hongwei;Sha Weiqiang

机构地区：[1]景旺电子科技(龙川)有限公司,广东龙川517373 [2]广东省金属基印制电路板工程技术研究开发中心,广东河源517373

出　　处：《印制电路信息》2020年第6期52-54,共3页Printed Circuit Information

摘　　要：随着电子产品的高密度、多功能及微电子集成技术的高速发展,对PCB的散热要求越来越高。文章以一款四层印制板与铝基混压的产品为研究对象,重点介绍了产品工艺流程设计、粘结层材料选择、压贴等关键制作技术,最终获得高耐热性的铝基多层板。With the rapid development of high density,multi-function and microelectronic integration technology of electronic products,the requirement of PCB heat dissipation is becoming higher and higher.In this paper,a four layer high heat dissipation substrate mixed laminated with PCB and aluminium Substrate product is taken as the research object.The key manufacturing technologies,such as process design,material selection of bonding layer and pressing,are mainly introduced.The aluminium Substrate multilayer board with high heat resistance is obtained as a result.

关 键 词：铝基板 混压 粘结层 

分 类 号：TN41[电子电信—微电子学与固体电子学]