改性松香对SnAg3.0Cu0.5焊锡膏性能的影响  

The Effect of Modified Rosin on the Performance of SnAg3.0Cu0.5 Solder Paste

作　　者：张欣 秦俊虎 何欢 武信 ZHANG Xin;QIN Jun-hu;HE Huan;WU Xing(Yunnan Tin Industry Tin Material Co.,Ltd.,Kunming,Yunnan 650501,China)

机构地区：[1]云南锡业锡材有限公司,云南昆明650501

出　　处：《云南冶金》2020年第3期83-87,共5页Yunnan Metallurgy

基　　金：国家重点研发计划项目(2017YFB0305703)。

摘　　要：通过改性松香对铜板腐蚀性实验,确定、优选出腐蚀性较小的两种改性松香,研究了改性松香及其复配对焊锡膏扩展率及粘度的影响,测试了焊锡膏的锡珠、坍塌、润湿性等性能。结果表明:不同类型的改性松香对铜板腐蚀、扩展率、粘度等均匀有较大的影响,适当的改性松香复配可有效提高焊接性,调配锡膏粘度。The copper plate corrosion test by modified rosin is done to confirm and optimize two kinds of modified rosin with less corrosive;the effect of the modified rosin and its compound on the expansion rate and viscosity of solder paste is researched,and the solder ball,slump,wettability and the other performances are tested.The results show:there is big effect of the copper plate corrosion,expansion rate,viscosity and the other performances with the different type of the modified rosin,the proper modified rosin compound can improve the weldability,blend the viscosity of solder paste.

关 键 词：改性松香 焊锡膏 SnAg3.0Cu0.5 

分 类 号：TG146.14[一般工业技术—材料科学与工程]