印制线路板化学镀镍工艺及应用  

Electroless Nickel Plating on Printed Circuit Board and Its Application

作　　者：何海良 He Hailiang(Shishi Jiumu Bathroom Co.,Ltd.,Fujian,362700)

机构地区：[1]石狮九牧卫浴有限公司,福建362700

出　　处：《当代化工研究》2020年第13期127-128,共2页Modern Chemical Research

摘　　要：化学镀镍作为印制电路板表面处理工艺,可以作为后续镀金的扩散阻挡层或者可焊性镀层,因而被广泛关注和研究。本文针对印制线路板化学工艺进行了探索性的研究,介绍了化学镀镍原理并针对印制板表面化学镀镍工艺进行了探索性研究。Electroless nickel plating,as a surface treatment process for printed circuit boards,can be used as a diffusion barrier or solderability coating for subsequent gold plating,so it has been widely concerned and studied.This paper makes an exploratory study on the chemical process of printed circuit boards,introduces the principle of electroless nickel plating and makes an exploratory study on the electroless nickel plating process on the surface of printed circuit boards.

关 键 词：化学镀镍 印制线路板 镀层厚度 

分 类 号：T[一般工业技术]